高頻混壓板可以是FR4和高頻板材的混合，或者不同DK的高頻板材的混合，這種電路板具有耐高溫性能和優(yōu)異耐輻射性，這種結構的高頻電路板能夠滿足局部高頻信號傳輸?shù)囊?，領智電路是一家專業(yè)提供TU883 PCB打樣，TU883 PCB加工，TU883 PCB批量制作等一站式印刷電路板的生產廠家。ThunderClad 2 ( TU-883 ) is a very low loss category material based on a high performance resin. This material is reinforced with regular woven E-glass and designed with very low dielectric constant and dissipation factor resin system for high speed low loss, radio frequency and wireless applications. ThunderClad 2 material is suitable for environmental protection lead free process and also compatible with FR-4 processes. ThunderClad 2 laminates also exhibit excellent moisture resistance, improved CTE, superior chemical resistance, thermal stability and CAF resistance.
1. Applications
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Radio frequency
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Backplane, High performance computing
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Line cards, Storage
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Servers, Telecom, Base station, Office Routers
2. Performance and Processing Advantages
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Excellent electrical properties
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Dielectric constant less than 4.0
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Dissipation factor less than 0.005
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Stable and flat Dk/Df performance over frequency and temperature
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Compatible with modified FR-4 processes
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Excellent moisture resistance and Lead Free reflow process compatible
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Improved z-axis thermal expansion
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Anti-CAF capability
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Excellent through-hole and soldering reliability
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Halogen Free
3. Industry Approvals
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IPC-4101 Type Designation: /134
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IPC-4101/134 Validation Services QPL Certified
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UL File Number : E189572
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ANSI Grade : No-ANSI
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Flammability Rating: 94V-0
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Maximum Operating Temperature: 160°C
4. Standard Availability
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Thickness: 0.002”[0.05mm] to 0.062”[1. 58mm], available in sheet or panel form
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Copper Foil Cladding: 1/3 to 5 oz for built-up & double sides
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Prepregs: Available in roll or panel form
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Glass Styles: 106, 1080, 3313, 2116 and other prepreg grades are available upon request
